Conductivity control System ( CCS ), By Chemwest for sale in Campbell, CA
Conductivity control System ( CCS ), By Chemwest.Very good condition! CONDUCTIVITY CONTROL SYSTEM (CCS) OVERVIEWThe Chemwest Conductivity Control System (CCS) has been designed to continuously adjust the amount of CO2 injected into an ultrapure water (UPW) stream to achieve the targeted conductivity. Changes in the UPW flow rate are not a problem for the CCS. Closed-loop control based upon conductivity is used to ensure the conductivity is maintained even as the flow rate changes rapidly.The system uses membrane contactor technology to provide bubble-free injection of the CO2. An all fluoropolymer flow path is used to maintain the purity of the DI water and prevent the introduction of particles or contaminates.The CCS operates in a wide range of UPW flow rates and conductivity levels providing the flexibility to meet an array of application requirements.APPLICATIONSWet Etch Clean (WEC) critical rinsesExtreme Ultraviolet Lithography (EUV) mask cleaningPhotolithography reticle cleaningPhotolithography spin-rinse processPost Chemical Mechanical Planarization (CMP) rinse processPhotoresist residual removalPROCESS BENEFITSPRE IMPROVEMENTThe use of low conductivity UPW during the wafer rinsing process prevents the dissipation of wafer surface changes that may be present on the incoming wafer or generated during the rinse process. Particle attraction and adhesion to the wafer surface can result in yield limiting defects. Adding CO2 to UPW during the rinse process will help to reduce the surface charge and may allow for the release of these defect causing particles1 from the wafer surface.ESD DEFECT REDUCTIONStatic buildup on the wafer surface during the wafer rinse process can occur if low conductivity UPW is used. Catastrophic wafer defects due to electrostatic discharge (ESD) have been reported as a result of this static buildup during spin rinse processing.2 Increasing the conductivity of the UPW rinse water through the use of CO2 injection can significantly reduce this type of defect.CORROSION CONTROLCorrosion of metal lines (Cu, Al) can occur during the UPW rinse process that follows resist/polymer removal with amine based chemistries. This is due to the creation of hydroxyl ions when the water interacts with the hydroxyl amines. The addition of CO2 into the UPW rinse water neutralizes the hydroxyl ions preventing this metal corrosion from occurring.31 Harumoto, M. et al., "Post-Develop Blob Defect Reduction", SPIE Advanced Lithography 2009, Conference Proceedings Paper. http://spie.org/x648.xml?product_id=8136052 Halladay, J. et al., "Elimination of ESD Defects Using DICO2", SEMATECH Surface Preparation and Cleaning Conference, March 31-April 2, 2008 http://qcepttech.com/documents/0210HalladaySpansion.pdf3 Gu, M. et al., "An Improved Wet Cleaning Method for 90nm Node- Semiconductor processing Technology", Future Fab Intl., Issue 18, Jan. 12, 2005 http://www.future-fab.com/documents.asp?d_iD=3028 FEATURES AND BENEFITSFeatures BenefitsAutomatic Conductivity ControlHigh performance, high precision closed loop conductivity control ensures optimum process stability and maximizes process windowDirect Injection Gasification MethodDelivers a stable conductivity CO2 / UPW mixture with low gas consumption and simple system design and control with no bubble generationProgrammable MaintenanceAutomatic maintenance of membrane contactor ensures optimum gas transfer efficiency and minimum downtimeVisual Human/Machine Interface softwareVisual touchscreen software allows simple setup and programming of process conditionsEmbedded CommunicationAnalog and digital output to customer tool and remote control by customer tool through industry standard connectors and protocols. Provides connections via Customer Ethernet for data logging / monitoring functionsSafety Alarms, SensorsProcess parameter alarms and system leak sensors ensure process and machine safety.
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